Micro-Thermography Opens Up New Possibilities for Quality Control and Development

Micro-thermography with detailed image

Complex electronics are becoming more powerful and smaller, so that in their development, thermal management is becoming increasingly important. The placement of electronic components on printed circuit boards is done in a small space, so good heat dissipation is necessary. Microthermography allows for the thermal analysis of extremely small structures in the micrometer range, providing a detailed representation of the temperature distribution on complex electronic assemblies and components.

The thermal imaging camera series VarioCAM® High Definition and ImageIR® by InfraTec can be equipped with microscope objectives of different magnification factors.

Using the 8x microscope of ImageIR®, for example, high-resolution detail shots of eletronic assemblies and components can be produced with a pixel size of up to 2 µm. By using the opto-mechanical real-time MicroScan unit of the infrared camera series VarioCAM® High Definition, which is designed for continuous operation, up to (2,048 x 1,536) IR pixels can be achieved. At this resolution, even the smallest defects in measurement areas can still be reliably detected.

On Demand: Micro-Thermography – Contactless Temperature Measurement in the Micrometer Scale

  • What are the physical characteristics of micro-thermography?
  • What are the technical requirements for an IR camera system?
  • Which selection criteria are important and relevant?
  • What are the advantages and disadvantages of cooled and uncooled camera systems?
  • In which application areas is micro-thermography used?

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TRAILER: Micro-Thermography – Contactless Temperature Measurement in the Micrometer Scale

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Case Studies about Micro-Thermography

Failure Analysis on Electronic Components | ©BTU Cottbus-Senftenberg
Get further information about ImageIR® 8300 for failure analysis on electronic components

Thermography on the Trail of the Fault

Today, thermographic damage and function analysis of electronic components is an established test method in electrical engineering. This method is also used for research purposes at the Institute for Electrical Systems and Energy Logistics at BTU Cottbus-Senftenberg. In this context, Prof. Dr. Ralph Schacht is intensively involved with the material and system characterisation as well as the non-destructive failure analysis of printed circuit boards, electronic components, microelectronics as well as composite systems of packaging and interconnection technology.

Get further information about ImageIR® 9300 for nanotechnologies

Thermal Micro Actuators for Nanotechnologies

Microelectromechanical systems (MEMS) offer a wide range of possible applications in the field of nanotechnology. Everyday examples are the position recognition of mobile phones and the use in airbags, digital cameras or pacemakers. Other applications can be found above all in the field of miniaturised medical diagnostics. Growing demands on miniaturisation affect both the system solutions required for this and the sensors and control elements to be developed.

Inverter with loaded components to forecast their lifecycle - picture credits: @ istock.com / Mordolff
Usage of the infrared camera ImageIR® 8300 at the Fraunhofer-Institut für Silizium-technologie (ISIT)

Thermographic Microscopy in Electronics

At the same time that the performance of electronic components is being driven ever higher the demand for thermal management at ever smaller scales is also occurring.

Nickel‐titanium Wires in Tension Test - Picture credits: © iStock.com / tunart
Usage of ImageIR® 9300 at Saarland University

Nickel-titanium Wires in Tension Test

How do solid materials change structurally? The engineers Prof. Stefan Seelecke and Marvin Schmidt from Saarland University investigate this fundamental question in materials research. Both consider this topic with the help of microthermography. Their cutting-edge basic research ensures that we will have even more energy-efficient electric devices to use at home in future.

Thermography in Electronics Development - Picture credits: © iStock.com / Jimmyan
Usage of infrared thermography at Delphi Deutschland GmbH

Thermography in Electronics Development

At Delphi’s laboratory plant “Test & Validation Services”, thermography is used for design and product validation as part of quality assurance. Therewith, a stable hardware basis is set for integrating new technologies in motor vehicles that again present a substantial contribution to traffic safety.

Associated Thermographic Automation Solutions

  • Automation InfraTec INDU-SCAN - In-process industrial temperature measurement
    Process Control - INDU-SCAN

    Process Control - INDU-SCAN

    Contactless measurement of temperature distributions and profiles with industrial thermographic cameras permits efficient monitoring and control of temperature-dependent processes and procedures within a system-integrated quality assurance programme in industry.

  • Thermography test solution E-LIT
    Electronic / Semiconductor Testing - E-LIT

    Electronic / Semiconductor Testing - E-LIT

    Detect inhomogeneous temperature distribution and local power loss during the production using the Lock-in thermography.

  • PV-LIT test solution for solar cells
    Photovoltaic Test System - PV-LIT

    Photovoltaic Test System - PV-LIT

    Get advantages in costing and quality by non-contact thermographic testing of your solar cells and PV-modules.

Advantages of this Thermography Solutions in this Application

  • MicroScan feature ImageIR
    Further information about MicroScan

    MicroScan – Quadrupling the Number of Pixels

    Displaying measurement objects with extremely low noise and fine resolution – this is what MicroScan is for. Using this function, the native pixel number of the detector can be quadrupled. This results in thermograms of better image quality with geometric resolutions of more than 5.2 Megapixels. Each pixel in the image represents a true temperature reading, not an interpolated pixel.

  • Thermografie-Kameraserie ImageIR® mit neuer 10 GigE-Schnittstelle
    Further information about the 10 GigE technology

    10 GigE Interface for a Strong Increase in Output

    The 10 Gigabit Ethernet interface of the high-end camera series ImageIR® opens this extremely fast transmission standard with a NIC specially developed by InfraTec. This works with optical or electrical transceiver modules that are easy to change and are called SFP+.

    Different 10 GigE fiber SFP+ transceivers allow transmission ranges of up to ten kilometers with the same low sensitivity to electromagnetic interference. A corresponding standard SFP ensures backward compatibility with the conventional GigE interface. This combination allows the ease of use of the cameras with the 10 Gigabit Ethernet interface in existing systems - though at a reduced transmission rate.

  • InfraTec Glossary Motorfocus
    Further information about the motor focus

    Motor Focus for ImageIR® Full Lenses – More Comfort

    All interchangeable standard lens systems of the ImageIR® series can be combined with a motor focus unit, which is controlled by the camera operating software. It enables precise, remote and fast focusing. In addition, an autofocus function is available which operates reliably even with low image contrasts.

  • Further information about lenses

    High-performance Full Optics

    High quality precision lenses allow the adaptation of the image geometry to almost every measuring situation. Its performance parameters are calibrated with respect to functionality, quality and flexible application. Due to proper IR-transparent lens materials and high-precision antireflexion coating, the lenses are optimised for different spectral ranges.

  • InfraTec thermography - Geometrical Resolution

    Geometrical Resolution – Efficient Analysis of Complex Assemblies

    InfraTec's infrared cameras with cooled and uncooled detectors have native resolutions up to (1,920 × 1,536) IR pixels. Spatially high-resolution thermograms ensure that components and assemblies are imaged down to the smallest detail and thus defects can be reliably detected and precisely localised.

Get in contact with InfraTec thermography division

Would You Like to Know More?

It is not unusual for tasks to be associated with special requirements. Discuss your specific application needs with our specialists, receive further technical information or learn more about our additional services.

Europe & Rest of World

InfraTec GmbH
Infrarotsensorik und Messtechnik
Gostritzer Str. 61 – 63
01217 DresdenGERMANY

Accurate Readings through Special Software

Operational concept thermographic software IRBIS 3

In contact-less temperature measurement, using infrared thermography in electronic assemblies, it should be noted that objects often have different emission behavior. For example, ceramics and plastics have a relatively high emissivity, while copper conductors and leads are very low. 

When using the correction models for automatic pixel-wise adjustment of the emissivity, as contained in the thermography software IRBIS® 3 from InfraTec, measurement errors can be avoided effectively. This function is performed after recording the emissivity distribution of a uniformly-heated test specimen. In the subsequent thermographic images, a precise correction of the emission levels takes place, thus giving a correct determination of the temperature of each individual object.

Infrared Cameras for Micro Thermography Applications

Associated Industries & Applications

  • thermal imaging for material testing
    Material Testing

    Material Testing

    Save time and costs by non-destructively testing components with infrared camera systems by InfraTec.

  • InfraTec - Additive manufacturing for process control
    Additive Manufacturing

    Additive Manufacturing

    By in-line monitoring of thermal process parameters, infrared cameras from InfraTec support the optimisation of additive manufacturing processes.

  • Laser Industry

    Laser Industry

    High-end thermography in heat-generating laser applications in materials processing.

  • thermal imaging for automotive applications
    Automotive Industry

    Automotive Industry

    Infrared camera systems help you to secure a high product quality in production and at your suppliers.

  • thermal imaging in aviation
    Aerospace Industry

    Aerospace Industry

    Comply with highest security demands by applying state-of-the-art infrared camera systems.

  • thermal imaging for thermal optimisation
    Thermal Optimisation

    Thermal Optimisation

    Identify possible problems already in the development phase well before serial production.

  • InfraTec Bondung and Sealing - Hot gas
    Bonding and Sealing

    Bonding and Sealing

    Users can utilise infrared cameras during bonding and sealing to monitor and control various technological parameters. This includes the geometry of the adhesive application, adhesive temperature and adherend temperature, curing temperature as well as the adhesive bond.

  • Thermal imaging of a horse
    Medicine

    Medicine

    Infrared camera systems help you to efficiently diagnose multiple illnesses with high certainty.

  • thermal imaging to inspect electrical installations
    Inspection of Electrical Installations

    Inspection of Electrical Installations

    Search electrical installations or high-voltage nets with infrared camera systems for dangerous hotspots.

  • thermal imaging for predictive maintenance
    Inspection of Mechanical Assemblies

    Inspection of Mechanical Assemblies

    Thermography reveals irregularities in heating of mechanical components in time.

  • thermal imaging to inspect phovoltaic installations
    Photovoltaic Inspection

    Photovoltaic Inspection

    Take advantage of thermography in order to visualise defects on existing and running photovoltaic installations.