Microthermography Opens Up New Possibilities for Quality Control and Development

Micro-thermography with detailed image

Complex electronics are becoming more powerful and smaller, so that in their development, thermal management is becoming increasingly important. The placement of electronic components on printed circuit boards is done in a small space, so good heat dissipation is necessary. Microthermography allows for the thermal analysis of extremely small structures in the micrometer range, providing a detailed representation of the temperature distribution on complex electronic assemblies and components.

The thermal imaging camera series VarioCAM® High Definition and ImageIR® by InfraTec can be equipped with microscope objectives of different magnification factors.

Using the 8x microscope of ImageIR®, for example, high-resolution detail shots of eletronic assemblies and components can be produced with a pixel size of up to 2 µm. By using the optomechanical real-time MicroScan unit of the infrared camera series VarioCAM® High Definition, which is designed for continuous operation, up to (2,048 x 1,536) IR pixels can be achieved. At this resolution, even the smallest defects in measurement areas can still be reliably detected.

Case Studies about Microthermography

Inverter with loaded components to forecast their lifecycle - picture credits: @ istock.com / Mordolff
Usage of the infrared camera ImageIR® 8300 at the Fraunhofer-Institut für Silizium-technologie (ISIT)

Thermographic Microscopy in Electronics

At the same time that the performance of electronic components is being driven ever higher the demand for thermal management at ever smaller scales is also occurring.

Thermography in Electronics Development - Picture credits: © iStock.com / Elhenyo
Usage of infrared thermography at Delphi Deutschland GmbH

Thermography in Electronics Development

At Delphi’s laboratory plant “Test & Validation Services”, thermography is used for design and product validation as part of quality assurance. Therewith, a stable hardware basis is set for integrating new technologies in motor vehicles that again present a substantial contribution to traffic safety.

Accurate Readings through Special Software

Operational concept thermographic software IRBIS 3

In contact-less temperature measurement, using infrared thermography in electronic assemblies, it should be noted that objects often have different emission behavior. For example, ceramics and plastics have a relatively high emissivity, while copper conductors and leads are very low. 

When using the correction models for automatic pixel-wise adjustment of the emissivity, as contained in the thermography software IRBIS® 3 from InfraTec, measurement errors can be avoided effectively. This function is performed after recording the emissivity distribution of a uniformly-heated test specimen. In the subsequent thermographic images, a precise correction of the emission levels takes place, thus giving a correct determination of the temperature of each individual object.

Get in contact with InfraTec thermography division

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Associated Thermographic Automation Solutions

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    Process Control - INDU-SCAN

    Contactless measurement of temperature distributions and profiles with industrial thermographic cameras permits efficient monitoring and control of temperature-dependent processes and procedures within a system-integrated quality assurance programme in industry.

  • Automated Testing Solution ACTIVE-LIT - Header - Picture Credits: © iStock.com / scorpp
    Electronic / Semiconductor Testing - E-LIT

    Electronic / Semiconductor Testing - E-LIT

    Detect inhomogeneous temperature distribution and local power loss during the production using the Lock-in thermography.

Infrared Cameras for Micro Thermography Applications