Complex electronics are becoming more powerful and smaller, so that in their development, thermal management is becoming increasingly important. The placement of electronic components on printed circuit boards is done in a small space, so good heat dissipation is necessary. Microt-hermography allows for the thermal analysis of extremely small structures in the micrometer range, providing a detailed representation of the temperature distribution on complex electronic assemblies and components.
The thermal imaging camera series VarioCAM® High Definition and ImageIR® by InfraTec can be equipped with microscope objectives of different magnification factors.
Using the 8x microscope of ImageIR®, for example, high-resolution detail shots of eletronic assemblies and components can be produced with a pixel size of up to 2 µm. By using the opto-mechanical real-time MicroScan unit of the infrared camera series VarioCAM® High Definition, which is designed for continuous operation, up to (2,048 x 1,536) IR pixels can be achieved. At this resolution, even the smallest defects in measurement areas can still be reliably detected.