Europe’s largest research project ESiP (Efficient Silicon Multi-Chip System-in-Package Integration) for maximum integration and miniaturisation of microelectronics systems was awarded with the ENIAC Innovation Award 2013.
InfraTec´s ImageIR® camera series is getting another upgrade – with the new ImageIR® 8300 hp version thermal imaging enters a new era of high-speed thermography.
Due to the high level of interest in our last year’s Thermography-Day “Research & Development”, we are going to organise this event again for 2013 in Dresden.
Non-destructive testing of components is an important auxiliary process step, not only in post-production but also in regular maintenance. In the project “ThermoBot“ a fully automated test system is being developed in corporation with InfraTec GmbH.
As just recently surfaced, experts from the federal institute of geo sciences conducted important tests with an InfraTec supplied thermography camera during the turbulent June 2013 days.