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Press Releases of InfraTec

Read InfraTec press releases and get the latest news about our thermal imaging cameras, pyroelectric detectors and infrared technology.

  • Online Event: Thermography Compact, September 2026
    2026-06-24
    Online Event Thermography Compact
    Experience thermography – technical lectures and demonstrations plus professional exchanges.

    On 15 September 2026, interested parties and thermographers from science and industry will have the opportunity to learn more about the possibilities of thermography. The event will focus on challenging measurement tasks in research and development.

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  • Online Event „Thermography for Industrial Automation“ / August 2026
    2026-06-04
    Online Event: Thermography for Industrial Automation / August 2026
    Quality Assurance at the Highest Level

    In our free of charge online event “Thermography for Industrial Automation” we demonstrate how infrared thermography can be used as an imaging, non-contact measuring method for fast and reliable quality assurance in automated production processes. Learn how temperature distributions and temporal temperature profiles can be captured, analyzed, and used for effective process monitoring.

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  • InfraTec Thermografie-Anwenderkonferenz
    2026-05-05
    Online Event: Thermografie-Anwenderkonferenz „Forschung & Entwicklung“ (June 2026)
    Experience Thermography – Expert Presentations, Technology Demonstrations, and Professional Exchange

    Our free of charge “Thermografie-Awenderkonferenz” (thermography user conference) on June 17, 2026 provides a forum for professional exchange among users from academia and industry, with a particular focus on applications of thermography for demanding tasks in research and development.

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  • 3D digital image measurement and thermography is used to measure thermal stress-induced deformation of electronical components.
    2026-04-23
    Measurement of Thermal Stress-induced Deformation of Electronic Circuit Boards
    Method Combines 3D Digital Imaging with Thermography

    Detect thermally induced deformation of electronic circuit boards at an early stage: A combined measurement method using 3D digital imaging and thermography enables precise analysis of thermal stress during the design phase. This helps assess potential connection failures more reliably and supports targeted optimization of electronic components and mounting boards.

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  • Press Release Online Event Micro-Thermography
    2026-03-26
    Online Event: Micro-Thermography – Contactless Temperature Measurement in the Micrometer Scale
    Detecting the Smallest Defects with Micro-Thermography

    In our free of charge InfraTec online event „Micro-Thermography – Contactless Temperature Measurement in the Micrometer Scale“, you will learn everything you need to know about the basics and possibilities of micro-thermography. Our experts will provide practical tips on how to use this method efficiently to address your specific challenges.

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