The new generation of detectors now features closed loop control driven by an integrated ASIC and EEPROM.
Europe’s largest research project ESiP (Efficient Silicon Multi-Chip System-in-Package Integration) for maximum integration and miniaturisation of microelectronics systems was awarded with the ENIAC Innovation Award 2013.
InfraTec´s ImageIR® camera series is getting another upgrade – with the new ImageIR® 8300 hp version thermal imaging enters a new era of high-speed thermography.
Due to the high level of interest in our last year’s Thermography-Day “Research & Development”, we are going to organise this event again for 2013 in Dresden.
Non-destructive testing of components is an important auxiliary process step, not only in post-production but also in regular maintenance. In the project “ThermoBot“ a fully automated test system is being developed in corporation with InfraTec GmbH.