Conventional but especially the growing additive manufacturing processes – both in the prototype stage and in industrial production – require increasing quality control of the final products. These are mandatory to verify the properties of the material and the parts produced from it. In addition to the common destructive tests, nondestructive methods are increasingly being used, also in order to be able to expose series parts to real loads without gaps and to detect weak points.
The conceptual design of components modelled by the constructor needs to be validated by stress tests before used in practice. One of the established test methods is the measurement of deformation using strain gauges, which are attached to critical points of a component. However, apart from the time‐consuming preparation, this method only provides little punctual information. At this point, thermo‐elastic stress analysis based on high‐resolution thermal images offers significantly more advantages. With the help of the latest thermographic cameras, which make use of cooled or uncooled infrared focal plane array detectors with up to 5.2 megapixels, even intricately shaped test objects can be analysed very efficiently and non‐invasive. Based on the physical fact that materials show a thermal reaction when deformed, the cameras capture the resulting thermal signatures on the object contactless in just one inspection process. For this purpose, it is periodically stimulated by an external mechanical force, whereby the internal stress distribution can be visualised and analysed almost instantaneously. With the lock‐in method, even the smallest thermal reactions of < 1mK can be registered.
In the InfraTec online event “Efficient Material Testing – Non‐destructive and Contactless” participants are given an overview of this contactless and non‐destructive method. The physical background, the measuring principle and the used technology are presented along with examples.
Online Event: “Efficient Material Testing – Non‐destructive and Contactless”
with a technical lecture from thermography practice: "Contribution of Thermoelastic Stress Analysis in mechanics of materials and structures: some illustrations."
Speaker: Dr.‐Ing. Habil. Vincent Le Saux; École Nationale Supérieure de Techniques Avancées Bretagne
Date: Wednesday, October 26th, 2022 / Time: 4:00 PM – 5:30 PM EDT (22:00 – 23:30 CEST) – Registration
Date: Wednesday, October 26th, 2022 / Time: 3:00 PM – 4:30 PM (CEST) – Registration