Thermographic damage and functional analysis of electronic components has become one of the established testing methods in electrical engineering. This method is also used for research purposes at the Institute for Electrical Systems and Energy Logistics at BTU Cottbus-Senftenberg. In this context, Prof. Dr. Ralph Schacht focuses intensively on material and system characterization as well as non-destructive failure analysis of printed circuit boards, electronic components, microelectronics, and composite systems in assembly and interconnection technology.